The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Jun. 30, 2021
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Biancun Xie, San Diego, CA (US);

Shree Krishna Pandey, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/18 (2023.01); H01L 27/01 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 27/013 (2013.01); H01L 28/40 (2013.01);
Abstract

A package that includes a substrate, an integrated device coupled to the substrate, and an integrated passive device comprising at least two capacitors. The integrated passive device is coupled to the substrate. The integrated passive device includes a passive device substrate comprising a first trench and a second trench, an oxide layer located over the first trench and the second trench, a first electrically conductive layer located over the oxide layer the first trench, a dielectric layer located over the first electrically conductive layer, and a second electrically conductive layer located over the dielectric layer.


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