The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Jul. 29, 2021
Applicant:
Nippon Electric Glass Co., Ltd., Shiga, JP;
Inventor:
Hiroki Katayama, Shiga, JP;
Assignee:
NIPPON ELECTRIC GLASS CO., LTD., Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/15 (2006.01); H01L 23/00 (2006.01); H01L 23/12 (2006.01); H01L 21/56 (2006.01); C03C 3/093 (2006.01); C03C 3/091 (2006.01); B32B 17/06 (2006.01); C03C 19/00 (2006.01); B24B 37/07 (2012.01);
U.S. Cl.
CPC ...
H01L 23/15 (2013.01); B24B 37/07 (2013.01); B32B 17/06 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); C03C 19/00 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/12 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); B32B 2307/538 (2013.01); B32B 2457/14 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Devised are a supporting substrate capable of contributing to an increase in density of a semiconductor package and a laminate using the supporting substrate. A supporting glass substrate of the present invention includes a polished surface on a surface thereof and has a total thickness variation of less than 2.0 μm.