The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Aug. 26, 2020
Applicant:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Inventors:

Richard Korneisel, Cedar Rapids, IA (US);

Nathaniel P. Wyckoff, Marion, IA (US);

Brandon C. Hamilton, Marion, IA (US);

Kyle B. Snyder, Marion, IA (US);

Jenny Calubayan, Cedar Rapids, IA (US);

Assignee:

Rockwell Collins, Inc., Cedar Rapids, IA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/306 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6708 (2013.01); H01L 21/30604 (2013.01); H01L 21/4803 (2013.01);
Abstract

Systems and methods for selectively etching features in an electronic substrate via a precision dispense apparatus and precision etchant dispense tool are disclosed. The method includes creating a toolpath instruction for etching at least one feature in the substrate, programming the precision dispense apparatus to execute the created toolpath instruction, and causing the precision dispense tool to deposit etchant material onto the surface of the substrate to etch the substrate surface to produce the at least one feature according to the created toolpath instruction. The capabilities of the systems and methods disclosed herein extend to 3D substrates and post-build processing, among others.


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