The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Mar. 12, 2021
Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Akihiro Sato, Toyama, JP;

Tsuyoshi Takeda, Toyama, JP;

Yukitomo Hirochi, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/509 (2006.01); C23C 16/50 (2006.01); H01J 37/32 (2006.01); H05H 1/46 (2006.01); C23C 16/458 (2006.01); C23C 16/52 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32568 (2013.01); C23C 16/4587 (2013.01); C23C 16/50 (2013.01); C23C 16/509 (2013.01); C23C 16/52 (2013.01); H01J 37/3244 (2013.01); H01J 37/32834 (2013.01); H01L 21/0217 (2013.01); H01L 21/02274 (2013.01); H05H 1/46 (2013.01); H01J 2237/327 (2013.01); H01J 2237/3323 (2013.01); H01L 21/0228 (2013.01); H01L 21/02211 (2013.01);
Abstract

There is provided a plasma generating device that includes a first electrode connected to a high-frequency power supply, and a second electrode to be grounded, a buffer structure configured to form a buffer chamber that accommodates the first and second electrodes wherein the first electrode and the second electrode are alternately arranged such that a number of electrodes of the first electrode and the second electrode are in an odd number of three or more in total, and wherein the second electrode is used in common for two of the first electrode being respectively adjacent to the second electrode used in common, and wherein a gas supply port that supplies gas into a process chamber is installed on a wall surface of the buffer structure.


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