The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Jan. 10, 2022
Applicant:

BH Electronics, Inc., Burnsville, MN (US);

Inventors:

Ryan K. Cobian, New Brighton, MN (US);

Richard H. Jackson, Plymouth, MN (US);

Scott B. Conklin, Prior Lake, MN (US);

Assignee:

BH Electronics, Inc., Burnsville, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01); H01F 41/02 (2006.01); G03F 7/00 (2006.01); H01F 1/147 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0246 (2013.01); G03F 7/0017 (2013.01); H01F 1/147 (2013.01);
Abstract

A method of fabricating a laminated magnetic core including: fabricating a magnetic-core mold on a surface, the magnetic-core mold including a first wall portion having a first sidewall, a second wall portion having a second sidewall, the second sidewall located opposite the first sidewall, the first and second sidewalls and a portion of the surface defining a mold cavity having a bottom width that is greater than a top width; depositing a seed material on the mold top surface and on a portion of the surface so as to form a conductive layer, wherein the seed material is directed toward the mold top surface and the portion of the surface of the substrate at an angle of incidence that substantially prevents deposition of the seed material on the first and second sidewalls; forming a magnetic layer on the conductive layer; and forming an insulating-sealing layer on the magnetic layer.


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