The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

May. 13, 2021
Applicant:

Aptiv Technologies Limited, St. Michael, BB;

Inventors:

Jared Bilas, North Bloomfield, OH (US);

David R. Peterson, Aurora, OH (US);

Gerald A. Rhinehart, Jr., Lordstown, OH (US);

Assignee:

APTIV TECHNOLOGIES LIMITED, St Michael, BB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 13/012 (2006.01); G05B 19/04 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
H01B 13/01236 (2013.01); G05B 19/0405 (2013.01); G05B 19/4185 (2013.01); H01B 13/01209 (2013.01);
Abstract

An apparatus includes an extruding device configured to dispense a dielectric material though an orifice, a wire feed device configured to feed a conductive wire through the orifice, and a cutting device configured to sever the wire. It also includes an electronic controller configured to control the extruding device, the wire feed device, and the cutting device. The electronic controller commands the extruding device to dispense the dielectric material though the orifice, the wire feed device to feed the wire through the orifice, and the cutting device to sever the wire, thereby forming a dielectric substrate encasing a plurality of wires. The electronic controller further commands the extruding device to form an opening defined in the substrate in which plurality of electrically conductive wires is exposed and a location feature on the substrate located with a positional tolerance less than or equal to 1 mm relative to the opening.


Find Patent Forward Citations

Loading…