The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Mar. 24, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Daehyun Kwon, Hwaseong-si, KR;

Donghee Kim, Seoul, KR;

Sungoh Huh, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
G01R 31/2884 (2013.01); H01L 23/481 (2013.01); H01L 23/5227 (2013.01); H01L 25/0655 (2013.01);
Abstract

An integrated circuit device, a semiconductor substrate, and a test system including the integrated circuit device are disclosed. The integrated circuit device includes a power terminal configured to receive a source voltage, a power via connected to the power terminal and passing through at least one of a number of layers, a number of inductive vias arranged apart from the power via and passing through at least one of the number of layers, a number of wirings connected to ends of at least some of the number of inductive vias and configured to form a coil wound in toroidal form together with the number of inductive vias, around the power via, and a test terminal configured to output an induced voltage in the coil externally of the integrated circuit device, in response to the supply of the source voltage.


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