The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Aug. 06, 2019
Applicant:
Lg Electronics Inc., Seoul, KR;
Inventor:
Seungje Park, Seoul, KR;
Assignee:
LG ELECTRONICS INC., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25D 29/00 (2006.01); G06F 3/041 (2006.01); E06B 7/28 (2006.01); F25D 23/02 (2006.01); H03K 17/96 (2006.01);
U.S. Cl.
CPC ...
F25D 29/005 (2013.01); E06B 7/28 (2013.01); F25D 23/028 (2013.01); G06F 3/0412 (2013.01); G06F 3/0414 (2013.01); G06F 3/0416 (2013.01); H03K 17/962 (2013.01); F25D 2400/361 (2013.01); H03K 2217/960755 (2013.01);
Abstract
In a sensor assembly, a hole-shaped sensor support portion is formed at a sensor printed circuit board (PCB), a touch sensor is disposed at the sensor support portion, and an elastic member is installed at a rear surface of the sensor PCB. In addition, a sensor assembly according to an embodiment of the present invention may include a sensor PCB on which a copper coating film which constitutes a circuit is printed on a top surface of a plastic material, a touch sensor seated on a sensor support portion formed at the sensor PCB, and a cover member which is attached onto a rear surface of the sensor PCB and covers the sensor support portion.