The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Feb. 19, 2020
Mitsubishi Power, Ltd., Kanagawa, JP;
Shuji Tanigawa, Tokyo, JP;
Koichiro Iida, Tokyo, JP;
Ryuta Ito, Tokyo, JP;
Taro Tokutake, Tokyo, JP;
Yoshinori Wakita, Tokyo, JP;
MITSUBISHI POWER, LTD., Kanagawa, JP;
Abstract
A high-temperature component according to an embodiment is a high-temperature component which requires cooling by a cooling medium, and includes: a plurality of cooling passages through which the cooling medium is able to flow; a header portion to which downstream ends of the plurality of first cooling passages are connected; and at least one outlet passage for discharging the cooling medium flowing into the header portion to outside of the header portion. A roughness of an inner wall surface of the at least one outlet passage is not greater than a roughness of an inner wall surface of the plurality of first cooling passages in a region where a flow-passage cross-sectional area of the outlet passage is the smallest.