The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Oct. 12, 2020
Dow Global Technologies Llc, Midland, MI (US);
Rohm and Haas Company, Collegeville, PA (US);
Dow Quimica DE Colombia S.a., Bogota, CO;
Yinzhong Guo, Pearland, TX (US);
Juan Carlos Casarrubias, Mexico City, MX;
Kevin K. Miyake, Tower Lakes, IL (US);
Mateus Batista Torres Cipro, Sao Paulo, BR;
Elkin David Cardona Jimenez, Medellin, CO;
The Dow Chemical Company, Midland, MI (US);
Abstract
A two-component solventless polyurethane adhesive composition including (A) at least one isocyanate component and (B) at least one polyol component. The isocyanate component (A) comprises an isocyanate prepolymer that is the reaction product of (Ai) a polyisocyanate and (Aii) an isocyanate-reactive component; wherein the isocyanate-reactive component comprises (Aiia) at least one polyol having a functionality greater than two, (Aiib) at least one aromatic polyester polyol having a functionality of greater than two, and (Aiic) at least one hydrophobic polyol. The polyol component (B) comprises (Bi) at least one polyether polyol having a functionality greater than two, (Bii) at least one aromatic polyester polyol transesterified with a natural oil, and (Biii) at least one phosphate ester polyol. A method for forming a laminate is also disclosed, the method comprising the steps of: (I) mixing the above reactants (components (A) and (B)) to form a solventless adhesive composition, (II) applying a layer of the solventless adhesive composition to a surface of a first substrate, (III) bringing the layer of the solventless adhesive composition on the first substrate into contact with a surface of a second substrate to form a laminate, and (IV) curing the solventless adhesive composition. A laminate comprising the above solventless adhesive composition is also disclosed.