The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Jan. 15, 2019
Taiyo Holdings Co., Ltd., Hiki-gun, JP;
Tomotaka Noguchi, Hiki-gun, JP;
Yasuyo Kanazawa, Hiki-gun, JP;
Eiji Harima, Hiki-gun, JP;
Yasuaki Arai, Hiki-gun, JP;
TAIYO HOLDINGS CO., LTD., Hiki-gun, JP;
Abstract
Provided is a thermosetting resin composition which can suppress liquid dripping or bleeding from generating even when used for filling a hole in a printed wiring board having a large opening diameter of a hole part such as a through hole, and in particular, which can suppress cracks from generating even when used for filling a hole in a multilayer printed wiring board having a conductive part and an insulating part on the inner wall of a hole part such as a through hole. The thermosetting resin composition according to the present invention has a viscosity ratio R expressed by formula V/Vin the range of 5.0×10to 1.0×10, wherein V(dPa·s) is the viscosity measured by a cone-flat plate type rotational viscometer (cone-plate type) in accordance with JIS-Z 8803:2011 and V(dPa·s) is the minimum value of the melt viscosity measured at 60° C. to 100° C. in accordance with JIS-K7244-10:2005, and a pencil hardness of HB or more measured by a pencil hardness test according to JIS-K5600-5-4:1999 in a state of heating at 100° C. for 160 minutes.