The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Aug. 04, 2017
Applicant:

Amtek Research International Llc, Lebanon, OR (US);

Inventors:

Daniel Wandera, Corvallis, OR (US);

Jeff M. Frenzel, Albany, OR (US);

Richard W. Pekala, Corvallis, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 9/00 (2006.01); C08J 9/22 (2006.01); H01M 10/0525 (2010.01); H01M 10/06 (2006.01); H01M 50/411 (2021.01); H01M 50/417 (2021.01); H01M 50/431 (2021.01); H01M 50/437 (2021.01); H01M 50/44 (2021.01); H01M 50/446 (2021.01); H01M 50/491 (2021.01); C08J 9/32 (2006.01);
U.S. Cl.
CPC ...
C08J 9/22 (2013.01); C08J 9/0066 (2013.01); C08J 9/0085 (2013.01); C08J 9/32 (2013.01); H01M 50/411 (2021.01); H01M 50/417 (2021.01); H01M 50/431 (2021.01); H01M 50/437 (2021.01); H01M 50/44 (2021.01); H01M 50/446 (2021.01); H01M 50/491 (2021.01); C08J 2300/20 (2013.01); H01M 10/0525 (2013.01); H01M 10/06 (2013.01);
Abstract

A solidified, conformable porous composite having interconnected pores and containing thermally-expanded polymer microspheres and a particulate filler material is disclosed herein. An energy storage device containing a solidified, conformable porous composite having interconnected pores and comprising thermally-expanded polymer microspheres and particulate filler material is disclosed herein. A method of making a solidified, conformable porous composite in which no solvent is introduced into and extracted from the composite in the formation of pores is disclosed herein.


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