The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Jan. 16, 2019
Matsumoto Yushi-seiyaku Co., Ltd., Yao, JP;
Naoya Tayagaki, Yao, JP;
Katsushi Miki, Yao, JP;
MATSUMOTO YUSHI-SEIYAKU CO., LTD., Osaka, JP;
Abstract
Heat-expandable microspheres including a thermoplastic resin shell and a thermally-vaporizable blowing agent encapsulated therein. The thermoplastic resin is a polymer of a polymerizable component containing a cross-linkable monomer (A) which has at least two (meth)acryloyl groups per molecule and a reactive carbon-carbon double bond in addition to the (meth)acryloyl groups and has a molecular weight of at least 500. Also disclosed are hollow resin particles manufactured by expanding the heat-expandable microspheres; fine-particle-coated hollow resin particles including the hollow resin particles; a composition including a base component and the heat-expandable microspheres, or hollow resin particles, or fine-particle coated hollow resin particles; and a formed article manufactured by forming the composition.