The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Sep. 24, 2019
Toray Industries, Inc., Tokyo, JP;
Yasukazu Ono, Nagoya, JP;
Takafumi Hashimoto, Nagoya, JP;
Akira Shimoyama, Nagoya, JP;
Tetsuya Motohashi, Nagoya, JP;
Toray Industries, Inc., Tokyo, JP;
Abstract
A fiber-reinforced resin molding material is obtained by impregnating a chopped fiber bundle with a matrix resin, has a layered structure including three or more layers in a thickness direction thereof, and satisfies the relationships Lao>Lam and Wao>Wam, where Lao and Wao represent the number average fiber length and the number average fiber bundle width, respectively, of the chopped fiber bundle in the outermost layer thereof, and Lam and Wam represent the number average fiber length and the number average fiber bundle width, respectively, of the chopped fiber bundle in a middle layer thereof.