The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Mar. 04, 2021
Applicant:
Funai Electric Co., Ltd., Osaka, JP;
Inventor:
David L. Bernard, Lexington, KY (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B41J 2/14 (2006.01); B41J 2/16 (2006.01); B81B 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00087 (2013.01); B41J 2/14 (2013.01); B41J 2/162 (2013.01); B41J 2/1629 (2013.01); B81B 1/002 (2013.01); B81B 2201/052 (2013.01); B81B 2203/0353 (2013.01); B81C 2201/0132 (2013.01);
Abstract
An ejection head chip and method for a fluid ejection device and a method for reducing a silicon shelf width between a fluid supply via and a fluid ejector stack. The ejection head chip includes a silicon substrate and a fluid ejector stack deposited on the silicon substrate, wherein at least one metal layer of the fluid ejector stack is isolated from a fluid supply via etched in the ejection head chip by an encapsulating material.