The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Apr. 20, 2016
Applicant:
The Nippon Synthetic Chemical Industry Co., Ltd., Osaka, JP;
Inventor:
Shintaro Usui, Osaka, JP;
Assignee:
MITSUBISHI CHEMICAL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 30/00 (2006.01); B32B 27/34 (2006.01); B32B 27/00 (2006.01); B32B 27/28 (2006.01); B65D 81/34 (2006.01); B65D 65/40 (2006.01); B32B 27/32 (2006.01); B65D 81/24 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 37/12 (2006.01); B65D 75/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/34 (2013.01); B32B 7/12 (2013.01); B32B 27/00 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/306 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 37/12 (2013.01); B65D 65/40 (2013.01); B65D 75/008 (2013.01); B65D 81/24 (2013.01); B65D 81/3415 (2013.01); B32B 2250/04 (2013.01); B32B 2250/05 (2013.01); B32B 2250/24 (2013.01); B32B 2307/306 (2013.01); B32B 2307/308 (2013.01); B32B 2307/31 (2013.01); B32B 2307/7242 (2013.01); B32B 2307/7244 (2013.01); B32B 2307/7248 (2013.01); B32B 2439/02 (2013.01); B32B 2439/46 (2013.01); B32B 2439/70 (2013.01);
Abstract
An object of the present invention is to provide a stand-up pouch for retort which has a high rate of gas barrier property recovery after retort processing and can stably retain high gas barrier properties. The stand-up pouch for retort of the invention comprises a laminate which comprises a base film and, disposed over one surface of the base film, a polyamide resin layer, a saponified ethylene-vinyl ester copolymer layer, and a heat-sealing resin layer, wherein the polyamide resin layer adjoins the saponified ethylene-vinyl ester copolymer layer.