The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Nov. 02, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Justin Mamrak, Loveland, OH (US);

MacKenzie Ryan Redding, Mason, OH (US);

Thomas Graham Spears, Springdale, OH (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/268 (2017.01); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/393 (2017.01); B29C 64/165 (2017.01); B22F 12/41 (2021.01); B22F 10/366 (2021.01); B22F 12/37 (2021.01); B22F 12/67 (2021.01); B22F 12/70 (2021.01);
U.S. Cl.
CPC ...
B29C 64/268 (2017.08); B22F 10/14 (2021.01); B22F 10/28 (2021.01); B22F 10/366 (2021.01); B22F 12/41 (2021.01); B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B22F 12/37 (2021.01); B22F 12/67 (2021.01); B22F 12/70 (2021.01);
Abstract

A method, apparatus, and program for additive manufacturing. The additive manufacturing method may include solidifying at least a portion of a first layer () of build material () within a first scan region (A). At least one of a build unit () and a build platform () may be moved to solidify at least a portion of the first layer () of build material () within a second scan region (B). A second layer () of build material () may be provided over at least a portion of the first scan region (A) and the second scan region (B). A second layer () of build material () may be solidified within at least a portion of the third scan region (C), the third scan region (C) may at least partially overlap and may be offset with relation to the first scan region (A).


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