The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Aug. 31, 2022
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Maria del Carmen Querol Esparch, Sant Cugat del Valles, ES;
Laurent Herschke, Sant Cugat del Valles, ES;
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B33Y 10/00 (2015.01); B29C 64/165 (2017.01); B33Y 70/10 (2020.01); C09D 11/108 (2014.01); C09D 11/38 (2014.01); B29K 23/00 (2006.01); B29K 101/12 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 70/10 (2020.01); C09D 11/108 (2013.01); C09D 11/38 (2013.01); B29K 2023/14 (2013.01); B29K 2101/12 (2013.01); B29K 2105/0026 (2013.01); B29K 2105/0085 (2013.01);
Abstract
This disclosure describes compositions, kits, methods, systems, and three-dimensional parts. According to an example, described herein is a polymeric powder build material comprising a thermoplastic polymer powder composition, wherein the thermoplastic polymer powder composition comprises a polypropylene block copolymer made from a polymerizing propylene and ethylene or butylene or 1-pentene or 1-hexene or 1-octene or 4-methyl-1-pentene and polypropylene homopolymers.