IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11745294 B1

PDFFull Text
Date of Patent:
Sep. 05, 2023

Filed:

Nov. 03, 2017

Sinterable films and pastes and methods for use thereof

Applicant:

Henkel Ag & Co., Kgaa, Duesseldorf, DE;

Inventors:

Pukun Zhu, Irvine, CA (US);

Shashi Gupta, Tustin, CA (US);

Louis Rector, Santa Magarita, CA (US);

Qizhuo Zhuo, Irvine, CA (US);

Assignee:

HENKEL AG & CO., KGaA, Duesseldorf, DE;

Attorney:

Sun Hee Lehmann

Primary Examiner:

Christopher W Raimund

Int. Cl.
CPC ...
B23K 35/02 (2006.01); H01L 23/00 (2006.01); B32B 27/00 (2006.01); C08L 63/00 (2006.01); H01L 21/683 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B32B 7/06 (2019.01); B32B 7/12 (2006.01); B32B 27/36 (2006.01); B32B 15/08 (2006.01); B32B 27/38 (2006.01); B32B 15/20 (2006.01); B32B 27/40 (2006.01); B32B 27/30 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B23K 35/302 (2013.01); B23K 35/3006 (2013.01); B23K 35/3033 (2013.01); B23K 35/3613 (2013.01); B32B 27/00 (2013.01); C08L 63/00 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/205 (2013.01); B32B 27/281 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); B32B 2255/205 (2013.01); B32B 2264/102 (2013.01); B32B 2264/105 (2013.01); B32B 2264/12 (2013.01); B32B 2274/00 (2013.01); B32B 2307/202 (2013.01); B32B 2307/302 (2013.01); B32B 2307/542 (2013.01); B32B 2307/748 (2013.01); B32B 2457/14 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68377 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01);
Abstract

Provided herein are sinterable films and pastes as conductive die attach materials having advantageous properties for use in die semiconductor packages. Also provided are formulations useful for the preparation of such films and pastes, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In certain aspects, the invention relates to articles comprising such sintering films and pastes adhered to a suitable substrate therefor.

Find Patent Forward Citations

Loading…