The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Nov. 21, 2022
Applicants:

Joongwoo Nara Co., Ltd., Ansan-si, KR;

Bsp Co., Ltd., Anyang-si, KR;

Inventors:

Sung Soo Park, Yongin-si, KR;

Hong Jin Park, Anyang-si, KR;

Assignees:

JOONGWOO NARA CO., LTD., Ansan-si, KR;

BSP CO., LTD., Anyang-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/384 (2014.01); B23K 26/38 (2014.01); B23K 26/362 (2014.01); B23K 26/402 (2014.01); B23K 101/36 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/362 (2013.01); B23K 26/402 (2013.01); B23K 2101/36 (2018.08); B23K 2103/54 (2018.08);
Abstract

A glass panel processing method includes a first deformed portion formation step in which, in order to form a via-hole in a glass substrate, a first deformed portion is formed to a first depth from the upper surface of the glass substrate through irradiation with a laser beam along a planned via-hole line, a second deformed portion formation step in which, in order to cut the glass substrate into unit cells, a second deformed portion is formed to a second depth in the glass substrate through irradiation with a laser beam along a planned cutting line, and an etching step in which, the glass substrate with the first deformed portion and the second deformed portion formed therein is etched such that etching of the glass substrate along the planned cutting line is completed before completion of etching of the glass substrate along the planned via-hole line.


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