The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Jul. 24, 2019
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Autonetworks Technologies, Ltd, Yokkaichi, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Inventors:

Koki Sugimura, Osaka, JP;

Tetsuya Kuwabara, Osaka, JP;

Kazuhiro Goto, Osaka, JP;

Hiroki Hirai, Yokkaichi, JP;

Tetsuji Tanaka, Yokkaichi, JP;

Junichi Ono, Yokkaichi, JP;

Takuji Otsuka, Yokkaichi, JP;

Kenji Miyamoto, Yokkaichi, JP;

Osamu Nakayama, Yokkaichi, JP;

Kazuaki Hamada, Yokkaichi, JP;

Kazuhiro Washio, Yokkaichi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/323 (2014.01); B23K 26/244 (2014.01); B23K 26/60 (2014.01); C22C 21/02 (2006.01); C22C 21/00 (2006.01); B23K 103/10 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
B23K 26/323 (2015.10); B23K 26/244 (2015.10); B23K 26/60 (2015.10); C22C 21/00 (2013.01); C22C 21/02 (2013.01); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08);
Abstract

A metal member-welded structure includes: a Cu member; an Al member; and a welded portion formed by melting and solidifying each of materials of the Cu member and the Al member. The Cu member includes a Cu-based material containing Cu as a main component. The Al member includes an Al-based material containing Al as a main component and a plating layer that covers a side of the Al-based material, the side being close to a surface of the Cu member. The welded portion includes a sea-island structure in a vicinity of the surface of the Cu member. The sea-island structure includes: a plurality of island portions containing pure Al, and a sea portion interposed among the island portions. The sea portion has a eutectic structure having: a phase of an intermetallic compound of Cu and Al; and a phase of pure Al.


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