The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Jun. 24, 2021
Applicant:

National Cheng Kung University, Tainan, TW;

Inventors:

Hong-Chuong Tran, Tainan, TW;

Yu-Lung Lo, Tainan, TW;

Haw-Ching Yang, Tainan, TW;

Fan-Tien Cheng, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/364 (2021.01); B22F 10/37 (2021.01); B22F 10/85 (2021.01); B22F 10/28 (2021.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B33Y 40/20 (2020.01);
U.S. Cl.
CPC ...
B22F 10/364 (2021.01); B22F 10/28 (2021.01); B22F 10/37 (2021.01); B22F 10/85 (2021.01); B33Y 10/00 (2014.12); B33Y 40/20 (2020.01); B33Y 50/02 (2014.12);
Abstract

An additive manufacturing (AM) method is provided. The method includes performing a laser powder bed fusion (L-PBF) process on the powder layer. Then, a first surface roughness value of the powder layer after the L-PBF process is obtained to generate a first surface profile. An absorptivity and a set of re-melting process parameters data are used to perform a heat transfer simulation. A second surface profile of the powder layer after laser re-melting is obtained by using the first surface profile and a low-pass filter. Then, the set of re-melting process parameters data is adjusted iteratively to perform the heat transfer simulation until a second surface roughness value predicted from the second surface profile is smaller than or equal to a surface roughness threshold, thereby obtaining optimal values of re-melting process parameters for performing a re-melting process to reduce a surface roughness of a powder layer after the L-PBF process.


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