The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2023
Filed:
Oct. 30, 2018
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
James P. Shields, Corvallis, OR (US);
David A. Champion, Corvallis, OR (US);
Assignee:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 3/00 (2021.01); B33Y 40/20 (2020.01); B22F 3/10 (2006.01); B22F 10/10 (2021.01); B22F 10/14 (2021.01);
U.S. Cl.
CPC ...
B22F 3/003 (2013.01); B22F 3/10 (2013.01); B22F 10/10 (2021.01); B33Y 40/20 (2020.01); B22F 10/14 (2021.01); B22F 2003/1042 (2013.01); B22F 2998/10 (2013.01);
Abstract
Techniques for using a pin array to support a 3D printed object during sintering are disclosed. An example method includes adjusting pins of a pin array to provide support for a bottom surface of the 3D printed object, and placing the 3D printed object on the pin array. The method also includes placing the 3D printed object and pin array in a sintering oven, and heating the 3D printed object in the sintering oven to sinter the 3D printed object while being supported by the pin array.