The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Nov. 30, 2021
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Kyle Brent Norell, Plano, TX (US);

Claude Albert Fernandez, Palatine, IL (US);

Charles Allen DeVries, Winfield, IL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/22 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/111 (2013.01); H05K 3/222 (2013.01); H05K 3/284 (2013.01); H05K 3/288 (2013.01); H05K 3/3421 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1031 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10628 (2013.01); H05K 2203/1316 (2013.01);
Abstract

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.


Find Patent Forward Citations

Loading…