The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Oct. 31, 2019
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-to, JP;

Inventors:

Kenichi Ogawa, Tokyo-to, JP;

Naoko Okimoto, Tokyo-to, JP;

Mitsutaka Nagae, Tokyo-to, JP;

Makiko Sakata, Tokyo-to, JP;

Toru Miyoshi, Tokyo-to, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H05K 1/189 (2013.01); H05K 3/0014 (2013.01); H05K 3/0064 (2013.01); H05K 3/1208 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09281 (2013.01); H05K 2201/2009 (2013.01);
Abstract

A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.


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