The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Mar. 14, 2022
Applicant:

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Taichi Misawa, Osaka, JP;

Keiji Tanaka, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0245 (2013.01); H05K 1/024 (2013.01); H05K 1/115 (2013.01);
Abstract

A printed board includes a first wiring layer including a first terminal, a second wiring layer including a second terminal facing to the first terminal, a dielectric layer interposed between the first wiring layer and the second wiring layer and having an end face, and a plurality of through-hole vias configured to electrically connect the first terminal and the second terminal. The plurality of through-hole vias includes a first through-hole via which is closest to an end-face edge of the first terminal, and a second through-hole via which is closest to an inner edge of the second terminal. The end-face edge being closer to the end face than the inner edge. A distance between the first through-hole via and the end-face edge is equal to or smaller than one eighth of a signal wavelength of a high speed signal transmitted through the first terminal.


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