The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Sep. 23, 2021
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Yi-An Chen, Miao-Li County, TW;
Wan-Ling Huang, Miao-Li County, TW;
Tsau-Hua Hsieh, Miao-Li County, TW;
Assignee:
InnoLux Corporation, Miao-Li County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 24/92 (2013.01); H01L 21/563 (2013.01); H01L 24/27 (2013.01); H01L 24/83 (2013.01); H01L 33/56 (2013.01); H01L 33/507 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/83102 (2013.01); H01L 2224/83859 (2013.01); H01L 2224/83931 (2013.01); H01L 2224/83947 (2013.01); H01L 2224/92125 (2013.01);
Abstract
A method of manufacturing an electronic device is disclosed. An electronic unit is provided. The electronic unit has a chip and at least one bonding pin. The electronic unit is mounted on the substrate through the at least one bonding pin, and an adhesive material is applied to a space between the chip and the substrate.