The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Mar. 12, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Satoshi Okuda, Tokyo, JP;

Tatsuro Watahiki, Tokyo, JP;

Tomohiro Tamaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/72 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01);
Abstract

An object of the present invention is to suppress electrical contact between an outer peripheral portion of an intermediate electrode and a front surface electrode of a semiconductor chip without increasing the area of the semiconductor chip. A facing surface of the first intermediate electrode facing a first main electrode is smaller than a facing surface of the first main electrode facing the first intermediate electrode, and has an outer peripheral protective region and a connection region surrounded by the protective region. A pressure-contact semiconductor device includes a plurality of first conductor films partially formed in the connection region, and a first insulating film formed in regions in the connection region where no first conductor films are formed and in the protective region.


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