The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Oct. 31, 2019
Kyocera Corporation, Kyoto, JP;
Kazushi Nakamura, Kyoto, JP;
Hidehisa Umino, Kyoto, JP;
KYOCERA Corporation, Kyoto, JP;
Abstract
A wiring substrate includes: an insulating substrate being shaped in a quadrangle in a plan view, including a mounting portion where an electronic component is mounted on a side of a principal surface of the insulating substrate, and having a recess on a side surface thereof; an inner surface electrode which is located on an inner surface of the recess; a via conductor which is located on a corner side of the insulating substrate in a perspective plan view and has both ends located in a thickness direction of the insulating substrate; and a wiring conductor, on the side of the principal surface of the insulating substrate, connecting the mounting portion, the inner surface electrode, and the via conductor, wherein, in a perspective plan view, the wiring conductor has a wiring conductor absent region which surrounds a region located between the mounting portion and the via conductor.