The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Dec. 12, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 23/49517 (2013.01); H01L 23/49562 (2013.01); H01L 25/074 (2013.01);
Abstract

A method comprises removing a portion of molding compound from a side of a package structure by a laser ablation process to create an opening that exposes a portion of a conductive clip, depositing solder paste on the exposed portion of the conductive clip, and reflowing the solder paste. The laser ablation process in one example is a pulsed laser ablation process that includes raster scanning a laser along a portion of the side of the package structure to create the opening. Depositing the solder paste in one example includes performing a dispense process or a screening process that deposits solder paste in the opening onto the exposed portion of the conductive clip.


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