The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Aug. 23, 2019
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Hitoshi Kamoshida, Tokyo, JP;

Hisayuki Takasu, Tokyo, JP;

Atsushi Kamino, Tokyo, JP;

Shota Aida, Tokyo, JP;

Megumi Nakamura, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/305 (2006.01); H01J 37/08 (2006.01); H01J 37/20 (2006.01); H01J 37/304 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3056 (2013.01); H01J 37/08 (2013.01); H01J 37/20 (2013.01); H01J 37/304 (2013.01); H01J 2237/026 (2013.01); H01J 2237/20207 (2013.01); H01J 2237/24535 (2013.01);
Abstract

The invention provides an ion milling device capable of cross-sectional milling on an all-solid-state battery while reducing an occurrence of a short circuit due to a redeposition film. The ion milling device includes a sample stageon which a sampleis placed, an ion sourceconfigured to emit an unfocused ion beamtoward the sample, a stage controllerconfigured to cause the sample stage to perform a swing operation centered on a swing axis Sset to be orthogonal to an ion beam center Bof the ion beam, and cause the sample stage to perform a sliding operation along a line of intersection between a plane (YZ plane) including the ion beam center and perpendicularly intersecting the swing axis and a sample placement surface of the sample stage, in which the stage controller causes, in a first mode operation, the sample stage to perform the swing operation and the ion source to emit the ion beam to mill the sample, and causes in a second mode operation, the sample stage to perform the sliding operation and the ion source to emit the ion beam to remove sputter particles adhered again to the sample in the first mode operation.


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