The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Jan. 15, 2020
Taiyo Yuden Co., Ltd., Tokyo, JP;
Shin Aida, Takasaki, JP;
TAIYO YUDEN CO., LTD., Tokyo, JP;
Abstract
A multi-layer ceramic capacitor includes a ceramic multi-layer chip, a side margin, and a bonding portion. The ceramic multi-layer chip includes a capacitance forming unit including internal electrodes, the internal electrodes being laminated in a first direction and including a base metal material as a main component, positions of end portions of the internal electrodes in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 μm in the second direction, and a cover that is disposed outside the capacitance forming unit in the first direction and includes ceramics as a main component. The side margin includes ceramics as a main component and covers the ceramic multi-layer chip in the second direction. The bonding portion is disposed on a bonding surface and includes an oxide including the base metal material, the bonding surface being bonded to the side margin on the cover.