The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Oct. 11, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Min-Chul Park, Hwaseong-si, KR;
Ami Ma, Suwon-si, KR;
Jisu Ryu, Hwaseong-si, KR;
Changwook Jeong, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor wafer fault analysis system includes: a database to store a first reference map, which is classified as a first fault type, and a second reference map, which is classified as a second fault type; a first auto-encoder/decoder to remove a noise corresponding to the first fault type from the first reference map to generate a first pre-processed reference map; a second auto-encoder/decoder to remove a noise corresponding to the second fault type from the second reference map to generate a second pre-processed reference map; and a fault type analyzer. The database is updated based on the first and second pre-processed reference maps, and the fault type analyzer is to classify a fault type of a target map based on the updated database. The target map is generated by measuring a target wafer.