The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Jun. 17, 2021
Applicant:

Linktel Technologies Co., Ltd., Wuhan, CN;

Inventors:

Baiquan Hu, Wuhan, CN;

Xuefeng Lin, Wuhan, CN;

Linke Li, Wuhan, CN;

Tianshu Wu, Wuhan, CN;

Xianwen Yang, Wuhan, CN;

Jian Zhang, Wuhan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4246 (2013.01); G02B 6/42 (2013.01); G02B 6/4207 (2013.01); G02B 6/428 (2013.01); G02B 6/4269 (2013.01);
Abstract

A silicon photonics integrated chip includes the transmit-input waveguide unit, the splitter unit, the modulator unit, the transmit-output waveguide unit, the receive-input waveguide unit and the receiving detector unit integrated inside the chip. A silicon photonics multi-channel parallel optical component and a coupling method of the silicon photonics multi-channel parallel optical component are also provided. The integrated silicon photonics chip is adopted, the transmitting part still uses two-way DC laser group, the receiving chip is integrated inside the silicon photonics chip, and the optical interface adopts the mature FA-MPO in the industry. It has the advantages of mature technology, high degree of integration, relatively low cost, fewer coupling processes, etc., it is one of the advantageous choices for rates above 400 G.


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