The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Feb. 07, 2022
Applicant:

Lutron Technology Company Llc, Coopersburg, PA (US);

Inventors:

Kuo-Lih Chang, Austin, TX (US);

Mickey Malone, Paige, TX (US);

Horace C. Ho, Austin, TX (US);

Assignee:

Lutron Technology Company LLC, Coopersburg, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 1/02 (2006.01); G01J 3/46 (2006.01); G01J 3/50 (2006.01); G01J 3/02 (2006.01); G01J 1/32 (2006.01); H05B 45/20 (2020.01); H05B 45/46 (2020.01); H05B 47/19 (2020.01); G01J 1/44 (2006.01); G01J 1/42 (2006.01); H05B 47/195 (2020.01);
U.S. Cl.
CPC ...
G01J 1/0252 (2013.01); G01J 1/32 (2013.01); G01J 3/0286 (2013.01); G01J 3/465 (2013.01); G01J 3/502 (2013.01); H05B 45/20 (2020.01); H05B 45/46 (2020.01); H05B 47/19 (2020.01); G01J 2001/4252 (2013.01); G01J 2001/444 (2013.01); H05B 47/195 (2020.01);
Abstract

An illumination device comprises one or more emitter modules having improved thermal and electrical characteristics. According to one embodiment, each emitter module comprises a plurality of light emitting diodes (LEDs) configured for producing illumination for the illumination device, one or more photodetectors configured for detecting the illumination produced by the plurality of LEDs, a substrate upon which the plurality of LEDs and the one or more photodetectors are mounted, wherein the substrate is configured to provide a relatively high thermal impedance in the lateral direction, and a relatively low thermal impedance in the vertical direction, and a primary optics structure coupled to the substrate for encapsulating the plurality of LEDs and the one or more photodetectors within the primary optics structure.


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