The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Sep. 23, 2020
Applicants:
Nisshinbo Holdings Inc., Tokyo, JP;
National Institute of Technology, Hachioji, JP;
Inventors:
Satoshi Kubota, Chiba, JP;
Gen Masuda, Chiba, JP;
Takaya Sato, Tsuruoka, JP;
Hiroyuki Arafune, Tsuruoka, JP;
Assignees:
NISSHINBO HOLDINGS INC., Tokyo, JP;
NATIONAL INSTITUTE OF TECHNOLOGY, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C10M 169/04 (2006.01); C10M 107/50 (2006.01); C10M 125/18 (2006.01); C10M 129/08 (2006.01); C10M 133/06 (2006.01); C10M 133/08 (2006.01); C10M 133/20 (2006.01); C10M 133/46 (2006.01); C10M 137/12 (2006.01); C10M 141/10 (2006.01); C10N 50/00 (2006.01);
U.S. Cl.
CPC ...
C10M 169/04 (2013.01); C10M 107/50 (2013.01); C10M 125/18 (2013.01); C10M 129/08 (2013.01); C10M 133/06 (2013.01); C10M 133/08 (2013.01); C10M 133/20 (2013.01); C10M 133/46 (2013.01); C10M 137/12 (2013.01); C10M 141/10 (2013.01); C10M 2201/081 (2013.01); C10M 2207/022 (2013.01); C10M 2215/26 (2013.01); C10M 2215/28 (2013.01); C10M 2215/30 (2013.01); C10M 2223/06 (2013.01); C10M 2229/0515 (2013.01); C10M 2229/0535 (2013.01); C10N 2050/023 (2020.05);
Abstract
A composite material comprising a plurality of polymer chains fixed to a base and swelled with a mixture which contains a salt and a hydrogen bond-donating compound and has a melting point maintained at 100° C. or less.