The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Oct. 27, 2021
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Makoto Nakamura, Tokyo, JP;

Daiki Tomita, Tokyo, JP;

Shigekazu Takahashi, Tokyo, JP;

Bingbing Liu, Qingdao, CN;

Feng Zhao, Qingdao, CN;

Zhiqiang Liu, Qingdao, CN;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/00 (2019.01); B32B 27/00 (2006.01); C08G 18/00 (2006.01); C09J 175/06 (2006.01); B32B 7/12 (2006.01); B32B 27/40 (2006.01); C08G 18/32 (2006.01); C08G 18/48 (2006.01); C08G 18/50 (2006.01); C08G 18/76 (2006.01); C09J 175/08 (2006.01); C09J 175/04 (2006.01);
U.S. Cl.
CPC ...
C09J 175/06 (2013.01); B32B 7/12 (2013.01); B32B 27/40 (2013.01); C08G 18/3275 (2013.01); C08G 18/4825 (2013.01); C08G 18/5021 (2013.01); C08G 18/5024 (2013.01); C08G 18/7671 (2013.01); C09J 175/04 (2013.01); C09J 175/08 (2013.01); B32B 2553/00 (2013.01);
Abstract

Provided are a solvent-free two-component type adhesive capable of guaranteeing a practical packaging property, with an excellent curing property and significantly shortening aging time, a laminated film using the same, and a polyol composition for an adhesive. An adhesive, characterized in comprising a polyisocyanate composition (X) containing a polyisocyanate (A), and a polyol composition (Y) containing a polyol (C) and a tertiary amine compound (B) having multiple hydroxyl groups, as necessary components.


Find Patent Forward Citations

Loading…