The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Mar. 31, 2021
Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Chu-Heng Liu, Penfield, NY (US);

Douglas K. Herrmann, Webster, NY (US);

Jason M. LeFevre, Penfield, NY (US);

Paul J. McConville, Webster, NY (US);

Seemit Praharaj, Webster, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/01 (2006.01); B41J 11/00 (2006.01);
U.S. Cl.
CPC ...
B41J 11/0085 (2013.01);
Abstract

A printing system comprises a printhead to eject a print fluid to a deposition region. Print media are held against a movable support surface via vacuum suction, and the movable support surface transports the print media through the deposition region. A vacuum plenum comprises a vacuum platen over which the movable support surface moves. The vacuum platen has platen holes that communicate the vacuum suction from the vacuum plenum to the movable support surface. An airflow restriction mechanism forms a high impedance zone in the vacuum platen, the high impedance zone comprising a subset of the platen holes. The airflow impedance through the high impedance zone is relatively high compared to the airflow impedance through another subset of the platen holes, which are part of a low impedance zone. The high impedance zone may be located near the printhead to reduce airflow through uncovered platen holes near the printhead.


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