The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Nov. 17, 2017
Hewlett-packard Development Company, L.p., Spring, TX (US);
Sterling Chaffins, Corvallis, OR (US);
Kevin P DeKam, Corvallis, OR (US);
Kristopher J Erickson, Palo Alto, CA (US);
Cory J Ruud, Corvallis, OR (US);
Jami Ryan Barone, Corvallis, OR (US);
Ruhua Cai, Corvallis, OR (US);
Anthony J Galvan, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Abstract
In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.