The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Jul. 14, 2021
Applicant:
Wuxi Unicomp Technology Co., Ltd., Wuxi, CN;
Inventors:
Assignee:
Wuxi Unicomp Technology Co., Ltd., Wuxi, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); C22C 5/00 (2006.01); B23K 35/30 (2006.01); C22C 5/02 (2006.01); B23K 103/12 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3013 (2013.01); C22C 5/02 (2013.01); B23K 2103/12 (2018.08);
Abstract
A filler for vacuum brazing of TU1 oxygen-free copper is an Au—Cu—Ni filler including the following elemental compositions in a specified proportion: 69% to 90% of Au, 9% to 30% of Cu, and 1% to 5% of Ni. The filler has a melting temperature of 900° C. to 910° C. The filler for vacuum brazing of TU1 oxygen-free copper can be used for brazing X-ray tube anodes, thereby realizing effective vacuum brazing.
Liu, Jun. (2023). Filler for vacuum brazing of tu1 oxygen-free copper and application thereof (U.S. Patent No. 11738413). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11738413
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile