The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
Jun. 08, 2022
Applicant:
Aptiv Technologies Limited, St. Michael, BB;
Inventors:
Stephen C. Antaya, West Kingston, RI (US);
William Falk, Warwick, RI (US);
Justin Amalfitano, East Providence, RI (US);
Amit Datta, East Greenwich, RI (US);
Assignee:
APTIV TECHNOLOGIES LIMITED, St. Michael, BB;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 13/00 (2006.01); C22C 30/04 (2006.01); C22C 30/06 (2006.01); B23K 35/26 (2006.01); B23K 103/12 (2006.01); B23K 103/00 (2006.01); B23K 103/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); C22C 13/00 (2013.01); C22C 30/04 (2013.01); C22C 30/06 (2013.01); B23K 2103/02 (2018.08); B23K 2103/12 (2018.08); B23K 2103/54 (2018.08); Y10T 428/12597 (2015.01); Y10T 428/12715 (2015.01); Y10T 428/12722 (2015.01);
Abstract
An electrical assembly includes an electrical connector soldered to a conductive pad disposed on a glass surface by a solder alloy consisting essentially of 17% to 28% indium by weight, 12% to 20% zinc by weight, 1% to 6% silver by weight, 1% to 3% copper by weight, and a remaining weight of the solder alloy being tin.