The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
May. 13, 2019
Dalian University of Technology, Liaoning, CN;
Guojun Ma, Liaoning, CN;
Chengwei Wu, Liaoning, CN;
Yuting Niu, Liaoning, CN;
Wei Zhang, Liaoning, CN;
Yongtao Lv, Liaoning, CN;
Xiao Han, Liaoning, CN;
Jianli Ma, Liaoning, CN;
DALIAN UNIVERSITY OF TECHNOLOGY, Liaoning, CN;
Abstract
An in-plane metal microneedle array and a manufacturing method therefor is disclosed. A large-size metal sheet is cut into small metal sheets. Inner sides of the upper and the lower cover plates of the tooling are provided with grooves matched with the sizes of the small metal sheets. Through holes are formed at edges around the cover plates. The metal sheets are placed in the grooves and fastened through bolts. The geometry and the size of a sheet microneedle array are designed, and a CAD model of the plane microneedles is built. A wire path is cut according to the CAD model. A few materials are reserved on both sides of substrates of the microneedle array without cutting. The unprocessed parts on both sides of the microneedle substrate are cut to obtain an in-plane metal microneedle array with a plurality of microneedle bodies.