The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 29, 2023

Filed:

Jun. 10, 2022
Applicants:

Rayence Co., Ltd., Gyeonggi-do, KR;

Vatech Ewoo Holdings Co., Ltd., Gyeonggi-do, KR;

Qpix Solutions Inc., Durham, NC (US);

Inventors:

Jin Woong Jeong, Gyeonggi-do, KR;

Ho Seok Lee, Gyeonggi-do, KR;

Chang Hyeuk Kim, Apex, NC (US);

Seungman Yun, Durham, NC (US);

Assignees:

RAYENCE Co., Ltd., Gyeonggi-do, KR;

VATECH EWOO Holdings Co., Ltd., Gyeonggi-do, KR;

Qpix solutions Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 6/00 (2006.01); G01T 1/16 (2006.01); B41F 16/00 (2006.01);
U.S. Cl.
CPC ...
A61B 6/584 (2013.01); G01T 1/16 (2013.01); B41F 16/00 (2013.01);
Abstract

Provided are an X-ray detector having fabrication fault tolerant structure and a method for manufacturing the same using a micro-transfer printing (MTP) technique. The X-ray detector may include a photodiode layer formed on a base substrate within a pixel area and including a plurality of photodiode pixel units, a dummy layer formed the base substrate within a peripheral area, a plurality of pixel driving integrated chips printed on the photodiode layer, a plurality of primary column and row integrated chips printed on the dummy layer, and metal lines coupling the column and row integrated chips with pixel driving integrated chips and other constituent elements, wherein the plurality of pixel driving integrated chips and primary column and row integrated chips are manufactured separately from the photodiode layer and the dummy layer and attached on the photodiode layer and the dummy layer, respectively.


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