The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Oct. 27, 2021
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Naoki Takojima, Asahikawa, JP;

Kairi Makita, Asahikawa, JP;

Fumio Ueno, Tokyo, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/62 (2010.01); F21S 4/24 (2016.01); H01L 21/66 (2006.01); H01L 25/075 (2006.01); F21S 43/14 (2018.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); F21S 4/24 (2016.01); F21S 43/14 (2018.01); H01L 22/12 (2013.01); H01L 25/0753 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting device, according to the present embodiment, has a light emitting panel, a flexible wiring substrate, a mold resin and a protective tape. The light emitting panel has a first substrate, which is transparent to light, a plurality of conductor patterns, which are formed on a surface of the first substrate, a plurality of light emitting elements, which are connected to any of the conductor patterns, and a resin layer, which holds the light emitting elements on the first substrate. The flexible wiring substrate has a circuit pattern that is electrically connected with an exposed part of the conductor patterns. The mold resin covers the exposed part of the conductor patterns and an exposed part of the circuit pattern. The protective tape covers the mold resin, and is wound around a joint part of the light emitting panel and the flexible wiring substrate.


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