The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Dec. 07, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Yoshiki Inoue, Anan, JP;

Shun Kitahama, Tokushima, JP;

Yoshiyuki Aihara, Tokushima, JP;

Yoshiki Matsushita, Tokushima, JP;

Keisuke Higashitani, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/22 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/007 (2013.01); H01L 33/22 (2013.01); H01L 33/507 (2013.01); H01L 2933/0041 (2013.01);
Abstract

A method for manufacturing a light-emitting element includes dividing a semiconductor structure into a plurality of light-emitting portions by removing a portion of the semiconductor structure so as to form an exposed region, a first surface being exposed from under the semiconductor structure in the exposed region; etching protrusions formed in the exposed region; bonding a light-transmitting body to a second surface so as to form a bonded body; forming a plurality of modified regions along the exposed region inside the substrate by irradiating a laser beam on the exposed region from the first surface side; removing a portion of the light-transmitting body that overlaps the plurality of modified regions in a plan view; and singulating the bonded body along the modified regions.


Find Patent Forward Citations

Loading…