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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11735557 B1

PDFFull Text
Date of Patent:
Aug. 22, 2023

Filed:

Mar. 19, 2021

Power module of double-faced cooling

Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Siho Choi, Seoul, KR;

Seongmoo Cho, Seoul, KR;

Kwangsoo Kim, Seoul, KR;

Gun Lee, Seoul, KR;

Assignee:

LG MAGNA E-POWERTRAIN CO., LTD., Seoul, KR;

Attorney:

Bryan Cave Leighton Paisner LLP

Primary Examiner:

Mouloucoulaye Inoussa

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); H01L 23/3733 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/0655 (2013.01); H01L 2224/29247 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A power module according implementations of the present disclosure includes a bonding layer for bonding two adjacent members. The bonding layer is formed by melting, applying, and solidifying a bonding material that has excellent thermal conductivity and electrical conductivity. The melted bonding material includes a plurality of anti-tilting members. The two members bonded during the process of solidifying the melted bonding material are supported by the plurality of anti-tilting members. This may allow tilting caused during the formation of the bonding layer to be suppressed.

Find Patent Forward Citations

Choi, Siho. (2023). Power module of double-faced cooling (U.S. Patent No. 11735557). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11735557

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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