The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

May. 21, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Takahito Watanabe, Yokohama, JP;

Risa Miyazawa, Isehara, JP;

Hiroyuki Mori, Yasu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/4857 (2013.01); H01L 23/49805 (2013.01); H01L 23/49811 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01);
Abstract

An integrated circuit package includes a substrate including at least one electrical connection to at least one of power or ground. The package further includes a bridge structure including at least one layer of conductive material and at least one layer of insulative material. The bridge structure is configured to be coupled to the substrate such that the conductive material is electrically connected to the at least one electrical connection. The bridge structure includes a side pad made of conductive material that is electrically connected to the at least one electrical connection. The side pad is in direct contact with the conductive material and with the insulative material of the bridge structure. The side pad forms an end face of the bridge structure such that the conductive material of the side pad is exposed.


Find Patent Forward Citations

Loading…