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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11735524 B1

PDFFull Text
Date of Patent:
Aug. 22, 2023

Filed:

Sep. 19, 2019

Electrical device having conductive lines with air gaps therebetween and interconnects without exclusion zones

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Benjamin D. Briggs, Waterford, NY (US);

Lawrence A. Clevenger, LaGrangeville, NY (US);

Christopher J. Penny, Saratoga Springs, NY (US);

Michael Rizzolo, Albany, NY (US);

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);

Attorneys:

Tutunjian & Bitetto, P.C.

Robert Sullivan

Primary Examiner:

Younes Boulghassoul

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01L 21/764 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/02266 (2013.01); H01L 21/02271 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/32133 (2013.01); H01L 21/764 (2013.01); H01L 21/7682 (2013.01); H01L 21/7685 (2013.01); H01L 21/76804 (2013.01); H01L 21/76808 (2013.01); H01L 21/76811 (2013.01); H01L 21/76814 (2013.01); H01L 21/76816 (2013.01); H01L 21/76831 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 21/76897 (2013.01); H01L 23/522 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H01L 23/53209 (2013.01); H01L 23/53214 (2013.01); H01L 23/53228 (2013.01); H01L 23/53271 (2013.01); H01L 23/53295 (2013.01); H01L 21/76834 (2013.01); H01L 21/76885 (2013.01); H01L 23/53223 (2013.01); H01L 23/53238 (2013.01); H01L 23/53252 (2013.01); H01L 23/53266 (2013.01);
Abstract

An electrical device includes a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parallel lengths, and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.

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