The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

May. 03, 2021
Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventors:

Yaojian Leng, Vancouver, WA (US);

Justin Sato, West Linn, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/66 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5223 (2013.01); H01L 21/67259 (2013.01); H01L 22/20 (2013.01); H01L 22/34 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 28/40 (2013.01);
Abstract

An array of metal-oxide-metal (MOM) capacitors formed in an integrated circuit (IC) structure may be used for evaluating misalignments between patterned layers of the IC structure. The array of MOM capacitors may be formed in a selected set of patterned layers, e.g., a via layer formed between a pair of metal interconnect layers. The MOM capacitors may be programmed with different patterned layer alignments (e.g., built in to photomasks or reticles used to form the patterned layers) to define an array of different alignments. When the MOM capacitors are formed on the wafer, the actual patterned layer alignments capacitors may differ from the programmed layer alignments due a process-related misalignment. The MOM capacitors may be subjected to electrical testing to identify this process-related misalignment, which may be used for initiating a correcting action, e.g., adjusting a manufacturing process or discarding misaligned IC structures or devices.


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