The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2023

Filed:

Jun. 26, 2019
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Shota Morisaki, Tokyo, JP;

Seiji Oka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/50 (2006.01); H02P 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/50 (2013.01); H01L 25/072 (2013.01); H02P 27/08 (2013.01);
Abstract

A semiconductor device includes: a first power supply terminal; a second power supply terminal; an output terminal; a first switching element connected between the first power supply terminal and the output terminal; and a second switching element connected between the second power supply terminal and the output terminal. The first power supply terminal includes: a first facing portion; a second facing portion; and a third facing portion. The first facing portion and the second facing portion are provided such that, upon application of a current, the current flows through the first facing portion and the second facing portion in a direction opposite to a direction in which the current flows through each of portions in the second power supply terminal that face the first facing portion and the second facing portion.


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